| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent solder from flowing even in case of an error in amount of solder or a position shift of a component. Ž<P>SOLUTION: A semiconductor device comprising a thin film substrate, a pad connecting an electronic component formed on the thin film substrate, a projection portion provided to the pad and formed to suppress flowing of solder, and the electronic component disposed while soldered to the pad has a cut provided at a position corresponding to the top of the electronic component connected to the pad and at a periphery of the pad. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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