| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounted type electronic component array that sufficiently prevents a plating liquid from penetrating an element body and relaxes stress to the element body while preventing solder from excessively creeping up. Ž<P>SOLUTION: A surface-mounted type capacitor array 1 includes a dielectric element body 10, and an external electrode 16A<SB>1</SB>disposed on the dielectric element body 10. The external electrode 16A<SB>1</SB>has a baked electrode layer 18A<SB>1</SB>, a resin electrode layer 20A<SB>1</SB>, a first plating layer 22A<SB>1</SB>, and a second plating layer 24A<SB>1</SB>. The resin electrode layer 20A<SB>1</SB>includes wide portions 201A<SB>1</SB>and 202A<SB>1</SB>and a narrow portion 203A<SB>1</SB>. The wide portions 201A<SB>1</SB>, narrow portion 203A<SB>1</SB>, and wide portion 202A<SB>1</SB>are disposed in this order in the extending direction of the resin electrode layer 20A<SB>1</SB>. The narrow portion 203A<SB>1</SB>is provided with a recess. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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