| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a both-sides conduction method for a wiring board, by which wiring patterns on both-sides of the wiring board having conductor layers constituting the wiring patterns and formed on the both-sides surfaces of a synthetic resin film base material are electrically conducted to each other with good efficiency, and the conduction portion is stabilized with low resistance. Ž<P>SOLUTION: The wiring board 1A, which has the conductor layers 3 and 4 constituting the wiring patterns and formed on the both-sides surfaces of the synthetic resin film base material 2, is compressed at conduction planned positions P of the both-sides wiring patterns from both sides of the wiring board 1A with a pair of ultrasonic bonding tools 5 and 6 to bring the both-sides conductors 3 and 4 into contact with each other by forcing a synthetic resin present between the conductor layers 3 and 4 at the conduction planned positions P toward a peripheral side, and the both-sides conductors contacted with each other are bonded together by ultrasonic vibrations from the ultrasonic bonding tools 5 and 6. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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