发明名称 INTERCONNECT STRUCTURE INCLUDING HYBRID FRAME PANEL
摘要 An electronic component includes a base insulative layer having a first surface and a second surface; at least one electronic device having a first surface and a second surface, wherein the electronic device is secured to the base insulative layer; at least one I/O contact located on the first surface of the electronic device; and a frame panel defining an aperture, wherein the electronic device is disposed within the aperture, and the frame panel is a multi-functional structure having a first region comprising a first material, wherein a surface of the first region secures to the base insulative layer; and a second region comprising a second material, wherein the first material and the second material differ from each other and have differing adhesability to the base insulative layer.
申请公布号 US2009255709(A1) 申请公布日期 2009.10.15
申请号 US20080102429 申请日期 2008.04.14
申请人 GENERAL ELECTRIC COMPANY 发明人 FILLION RAYMOND ALBERT;BITTING DONALD STEPHEN;ABRAHAM DANIEL LEE
分类号 H01B7/00 主分类号 H01B7/00
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