发明名称 |
CHEMICAL MECHANICAL PLANARIZATION PAD WITH VOID NETWORK |
摘要 |
<p>A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing at least a portion of the elements from the polishing pad forming void spaces within the polishing pad by one of a chemical method or mechanical method, prior to use in chemical/mechanical planarization procedures.</p> |
申请公布号 |
WO2009126171(A1) |
申请公布日期 |
2009.10.15 |
申请号 |
WO2008US72144 |
申请日期 |
2008.08.04 |
申请人 |
INNOPAD, INC.;HSU, OSCAR K.;LEFEVRE, PAUL;WELLS, PAUL ADAMS |
发明人 |
HSU, OSCAR K.;LEFEVRE, PAUL;WELLS, PAUL ADAMS |
分类号 |
B24D11/00 |
主分类号 |
B24D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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