发明名称 MANUFACTURE METHOD OF LEAD FRAME
摘要 PURPOSE: A manufacture method of a lead frame is provided to simplify a process since an additional nickel-plating is not need to improve the surface property of the lead frame in wire plating. CONSTITUTION: In a manufacture method of a lead frame, a lead frame material(10) is supplied. The lead frame material is composed of a first metal layer(11) for etching stop and a second metal layer(12). The first metal layer has double sides and the second metal is laminated on at least one side of the first metal layer. A photoresist is laminated on the both sides of the lead frame. The photoresist is selectively exposed or developed so that a region, to be planted, is defined on the lead frame material. A plating layer(30) is formed on a part in which a photoresist is removed for exposure and development.
申请公布号 KR20090107671(A) 申请公布日期 2009.10.14
申请号 KR20080033063 申请日期 2008.04.10
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 YU, SANG SOO;SHIN, DONG IL
分类号 H01L23/495 主分类号 H01L23/495
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