发明名称 |
MANUFACTURE METHOD OF LEAD FRAME |
摘要 |
PURPOSE: A manufacture method of a lead frame is provided to simplify a process since an additional nickel-plating is not need to improve the surface property of the lead frame in wire plating. CONSTITUTION: In a manufacture method of a lead frame, a lead frame material(10) is supplied. The lead frame material is composed of a first metal layer(11) for etching stop and a second metal layer(12). The first metal layer has double sides and the second metal is laminated on at least one side of the first metal layer. A photoresist is laminated on the both sides of the lead frame. The photoresist is selectively exposed or developed so that a region, to be planted, is defined on the lead frame material. A plating layer(30) is formed on a part in which a photoresist is removed for exposure and development. |
申请公布号 |
KR20090107671(A) |
申请公布日期 |
2009.10.14 |
申请号 |
KR20080033063 |
申请日期 |
2008.04.10 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
YU, SANG SOO;SHIN, DONG IL |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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