发明名称 Power semiconductor module with a bowl-shaped support base
摘要 The module has an electrical insulating substrate (5) arranged within a housing (3). The substrate consists of an insulating material body and electrically insulated metallic connection paths. A power semiconductor unit (72) is provided with a connecting unit. A base plate (2) has a tub-shaped part that encloses the substrate such that the side walls of the base plate exhibits larger height than the height level of a casting mass (80) inside the base plate, where the casting mass is silicon rubber and the plate is fixed to the substrate by an adhesive joint.
申请公布号 EP1753025(B1) 申请公布日期 2009.10.14
申请号 EP20060014878 申请日期 2006.07.18
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG 发明人 STOCKMEIER, THOMAS, DR.
分类号 H01L23/04;H01L23/24;H01L25/07 主分类号 H01L23/04
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