| 摘要 |
PROBLEM TO BE SOLVED: To allow an insulated circuit board and a power module to have high junction reliability. SOLUTION: The power module has a structure in which an insulating plate 11, a circuit layer 12 joined to one surface of the insulating plate 11 and a heat dissipator 16 joined to the other surface of the insulating plate 11, and a heat generator 30 is joined to the surface of the circuit layer 12. The insulating plate 11 is made of a resin material, has a plurality of insulating high temperature conductive hard particles mixed in the inside. The circuit layer 12 is formed of a pure Al or an Al alloy. The heat dissipator 16 has a longitudinal elasticity coefficient of 120,000 MPa-400,000 MPa, a thermal conductivity of 50 W/(mK)-200 W/(mK), and a thermal expansion coefficient of 2×10<SP>-6</SP>/°C-10×10<SP>-6</SP>/°C. At least one of the insulating high temperature conductive hard particles has both ends protruding to the circuit layer 12 and the heat dissipator 16. COPYRIGHT: (C)2006,JPO&NCIPI |
