A METHOD FOR CONTINUOUS INVESTIGATING PLATING ADHESION OF CONDUCTOR CIRCUIT LAYER

摘要

PURPOSE: A method for continuous investigating plating adhesion of a conductor circuit layer is provided to improve the reliability of product in short time even if a wire substrate has a minute and compact pattern. CONSTITUTION: A method for continuous investigating plating adhesion of a conductor circuit layer are comprised of the steps: measuring electrical conductivity of a conductive circuit layer of each wiring circuit in transferring a plurality of wiring circuits(10) consecutively; evaluating plating cohesive power of the conductive circuit layer; and using a probe card(20) connecting electric signal source and measurement unit with the conductive layer as a medium to measure the electrical conductivity of a conductive circuit layer.