发明名称 METHOD FOR FORMING CONDUCTIVE FILM
摘要 PURPOSE: A method for forming a conductive film is provided to prevent hydrogen from leaving on a semiconductor layer made of polycrystal silicon. CONSTITUTION: A method for forming a conductive film comprises the following steps of: spraying a dispersed solution(L) containing a plurality of conductive particles to a substrate(10A); heating the dispersed solution under formic acid atmosphere; and sintering the plural conductive particles to fuse them for the formation of the conductive film. The plural conductive particles are made of one selected from copper alloy, nickel alloy, and copper-nickel alloy.
申请公布号 KR20090107937(A) 申请公布日期 2009.10.14
申请号 KR20090029764 申请日期 2009.04.07
申请人 发明人
分类号 H01B1/22;H01B5/14;H05K3/10 主分类号 H01B1/22
代理机构 代理人
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