发明名称 |
PHOTORESIST RESIN AND PHOTORESIST RESIN COMPOSITION |
摘要 |
<p>A photoresist resin of the invention contains at least a constitutional repeating unit A containing a group capable of partially leaving by the action of an acid to thereby become soluble in an alkali, and a constitutional repeating unit B containing an alicyclic skeleton having a polar group, and has a weight-average molecular weight of 3000 to 15000 and has a content of polymer fractions each having a molecular weight exceeding 40000 of 4 percent by weight or less of the total resin. The molecular weight distribution (Mw/Mn) of the resin is, for example, from about 1.1 to about 3.0, and preferably from about 1.5 to about 2.5.</p> |
申请公布号 |
EP1676869(B1) |
申请公布日期 |
2009.10.14 |
申请号 |
EP20040746314 |
申请日期 |
2004.06.17 |
申请人 |
DAICEL CHEMICAL INDUSTRIES, LTD. |
发明人 |
KAMBARA, SHIGEKI;KISHIMURA, MASAAKI |
分类号 |
C08F220/10;G03F7/033;C08F22/20;C08F220/18;C08F220/20;C08F220/28;C08L33/14;G03C1/492;G03F7/039 |
主分类号 |
C08F220/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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