SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A substrate for a semiconductor package and a method of thereof are provided to implement not only a bonding pad with a micro width but also high input/output with a multi-row. CONSTITUTION: A substrate(100) for the semiconductor package is composed of raw materials(10a,10b), conductive films(20a,20b), and insulating layers(30a,30b). The semiconductor chip is adhered to the surface of the raw material, and the conductive film and insulating layer are reciprocally laminated and arranged on the external side of the raw material. The surface of the conductive film and the insulating layer is formed so that a step height is between them. A manufacturing method of the substrate for the semiconductor package is comprised of the steps: preparing a raw material of a columnar; laminating the conductive film and the insulating layer on the surface of the raw material; cutting the laminate by a certain thickness and manufacturing a piece of substrate for the semiconductor package; and etching the surface of the conductive film and the insulating film on the same surface of the substrate for semiconductor package or planting the conductive film.