Semiconductor device and method of its fabrication

摘要

In a plastic packaged semiconductor device, a chip support formed on the same lead frame as leads (3) is disposed so as to extend over the surface of a semiconductor element (1), the chip support is bonded and fixed to the surface of a polyimide wafer coat (9) on the semiconductor element (1) by means of an insulating tape, the leads (3) are brought into contact with the polyimide wafer coat (9) on the semiconductor element (1) without being fixed, the leads (3) and the electrodes of the semiconductor element (1) are connected by means of gold wires (6), and these are packaged by a packaging material (7). Generation of crack in the sealing material thereby prevented, and the thickness of the plastic packaged semiconductor device is reduced.