发明名称 Apparatus and method for cooling electronic components and thermally conductive sheet and method for producing thermally conductive sheet for use therewith
摘要 <p>A thermally conductive sheet 15 includes a thermally conductive layer 18 and an insulation layer 17 laminated onto the thermally conductive layer 18. The thermally conductive layer 18 includes matrix containing thermally conductive filler having an electrical conductivity. The insulation layer 17 contains thermally conductive filler having an insulating property. The thermally conductive sheet 15 is disposed so that the insulation layer 17 covers the terminal 13 of the electronic component 12 and the electric circuit 14. At this time, the thermally conductive layer 18 covers and closely contacts with the insulation layer 17 and the electronic component 12. The heat generated by the electronic component 12 is conducted to a cooling member 19 through the thermally conductive layer 18 and is ultimately dissipated. <IMAGE></p>
申请公布号 KR100921370(B1) 申请公布日期 2009.10.14
申请号 KR20020083672 申请日期 2002.12.24
申请人 发明人
分类号 H05K7/20;H01L23/36;H01L23/373 主分类号 H05K7/20
代理机构 代理人
主权项
地址