| 发明名称 |
Polishing slurry composition and method of using the same |
| 摘要 |
A polishing slurry composition including an abrasive, a pH-adjusting agent, a water-soluble thickening agent, and a chelating agent, wherein the chelating agent includes at least one of an acetate chelating agent and a phosphate chelating agent, and a method of using the same.
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| 申请公布号 |
US7601273(B2) |
申请公布日期 |
2009.10.13 |
| 申请号 |
US20060367406 |
申请日期 |
2006.03.06 |
| 申请人 |
CHEIL INDUSTRIES, INC.;MEMC KOREA CO., LTD. |
发明人 |
ROH HYUN SOO;PARK TAE WON;LEE TAE YOUNG;LEE IN KYUNG;LEE CHIN HO;KIM YOUNG WOO;CHOI MOON RO;KIM JONG SEOP |
| 分类号 |
C09K13/00 |
主分类号 |
C09K13/00 |
| 代理机构 |
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代理人 |
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