发明名称 |
Apparatus and method for thermal stabilization of PCB-mounted electronic components within an enclosed housing |
摘要 |
An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients. |
申请公布号 |
US7603205(B2) |
申请公布日期 |
2009.10.13 |
申请号 |
US20070843521 |
申请日期 |
2007.08.22 |
申请人 |
BRILLIANT TELECOMMMUNICATIONS, INC. |
发明人 |
BARRY CHARLES F.;PARKER REED A.;SHEN TIAN;PAN FENG F.;SUBRAMANIAN MEENAKSHI |
分类号 |
G05D23/00;G01K1/08;G01K17/00;G05B13/02;H05B1/02;H05B3/02 |
主分类号 |
G05D23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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