| 摘要 |
A plasma-dicing apparatus whereby a semiconductor wafer, which has a protective sheet that covers the entire circuit formation surface adhered thereto and also has an etching-resistant mask member adhered to the reverse surface on the reverse side from the circuit formation surface, is mounted on a mounting platform with the mask member facing up, performing plasma etching with the mask member as a mask, and dividing the semiconductor wafer into a plurality of semiconductor chips, comprising a ring-shaped frame member for holding an outer circumferential portion of the mask member extending out from an outer circumference of the semiconductor wafer, the platform being constituted by a wafer supporting portion for supporting the semiconductor wafer and a frame member supporting portion for supporting the frame member. Transporting the semiconductor wafer in and out of a vacuum chamber thus becomes easy.
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