| 摘要 |
PURPOSE: A wire for bonding of a semiconductor chip is provided to maintain same the hardness and degree of strength over whole external surface of a wire. CONSTITUTION: A wire for bonding of a semiconductor chip includes a wire core(120) and a coating layer(140). The wire core is manufactured by silver(Ag) or silver alloy. The coating layer is formed on the external surface of the wire core, and the coating layer is made of gold(Au). The purity of the gold(Au) is at least, 99.9% or over, and the thickness of the coating layer is 0.1 ~ 5um. A melting point of the silver(Ag) alloy is lower than that of the coating layer, and the hardness of the coating layer is 80 ~ 120 Hv. |
