EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING THE EMBEDDED SUBSTRATE

摘要

PURPOSE: An embedded circuit substrate and a method for manufacturing the same are provided to improve precision of the embedded circuit substrate with high precision while reducing the manufacturing cost. CONSTITUTION: An internal circuit substrate with a semiconductor chip and an internal circuit pattern is prepared(SA1). An anisotropy conductive material is arranged in an upper side of the semiconductor chip. An insulation layer is arranged in the region in which the semiconductor chip is not arranged(SA2). An external circuit substrate is arranged in an upper surface of the insulation layer and the anisotropy conductive material to perform the electrical connection between the semiconductor chip and the external circuit pattern of the external layer circuit substrate with the anisotropy conductive material(SA3).