发明名称 TOUCH SENSOR MODULE AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A touch sensor module and a manufacturing method thereof are provided to remove a need of a bracket member when the touch sensor module is mounted on an electronic device, thereby reducing manufacturing costs, manufacturing time and defects. CONSTITUTION: A touch sensor module(200) comprises the first substrate unit, the second substrate unit(210), and a reinforcing plate(220). A touch sensor electrode is formed on the first substrate unit. The first substrate unit is made of a flexible printed circuit board. The second substrate unit is integrally formed with the first substrate unit. The second substrate is located in a lower part of the first substrate unit by a bending unit. The bending unit is in a boundary with the first substrate unit. A reinforcing unit secures a gap between the first substrate unit and the second substrate unit so that the reinforcing unit is in at least one side of the first substrate unit and the second substrate unit.
申请公布号 KR20090106704(A) 申请公布日期 2009.10.12
申请号 KR20080032004 申请日期 2008.04.07
申请人 MELFAS, INC. 发明人 LEE, BYOUNG SOO;MIN, HYO KI
分类号 G02F1/1345 主分类号 G02F1/1345
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