| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To restrain an Sn-system plated Cu rectangular conductor with heat treatment from generating whisker down to an extent in which no short circuits or the like may occur between copper wirings or the like, even after being used in insertion coupling with a connector for a long period, concerning one of tin-system plated copper or copper alloy used as an FFC. <P>SOLUTION: Of the Sn-system plated Cu rectangular conductor for FFC having a Cu<SB>3</SB>Sn inter-metal compound phase (hereinafter called a B-phase), Cu<SB>6</SB>Sn<SB>5</SB>inter-metal compound phase (an A-phase), and pure Sn or Sn alloy layer formed in that order on the surface of the Cu rectangular conductor due to heat treatment at a terminal part of the Cu rectangular conductor, a maximum thickness of the pure Sn or the Sn alloy layer is 1.0μm, with an average thickness of 0.3 to 1.0μm, and at the same time, a ratio of production of the A-phase to the B-phase as A-phase/B-phase is to be 1.5 or more. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
