| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, which is excellent in flame resistance as well as in the balance of fluidity and soldering resistance although the composition is inexpensive without using a brominated epoxy resin or antimony compounds. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises: (A) an epoxy resin having a structure including a naphthalene structure having glycidyl ether and a benzene ring structure, in which a repeating unit of the specified naphthalene structure and a repeating unit of the benzene ring structure are present each in a specified range; (B) a hardening agent; and (C) an inorganic filler. A semiconductor device is obtained by sealing a semiconductor element with a hardened product of the epoxy resin composition for sealing a semiconductor. COPYRIGHT: (C)2010,JPO&INPIT |
