| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing tape which will not oversoften, in heat treatment which uses a thermosetting-type surface protective film, can be used in an expansion step for splitting an adhesive layer, and has uniform and isotropic expansion property. SOLUTION: This expandable wafer processing tape 10 is used for splitting an adhesive layer 13 along a chip by expansion and is provided with a base material film 11, a pasty layer 12 provided on the base material film 11, and an adhesive layer 13 provided on the pasty layer 12, wherein a lowermost layer 11b of the base material film is made of a thermoplastic resin, having a Vicat softening point of≥80°C, as defined by JIS K7206; and at least one layer 11a, other than the lowermost layer 11b of the base material film, is made of thermoplastic resin, having a Vicat softening point of 50°C-80°C defined by JIS K7206. COPYRIGHT: (C)2010,JPO&INPIT |
