| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board for suppressing a substrate area from becoming large in securing a private region for installing a pattern for a two-dimensional code. Ž<P>SOLUTION: Recognition marks 12 recognizable by a recognition device are formed at two corners on a diagonal line of a solder face becoming a rear side of a component mounting face of the printed wiring board 10 so that a position of the printed wiring board can be confirmed. A two-dimensional code part 13 is formed in a place corresponding to the recognition marks 12 on the component mounting face of the printed wiring board 10. The two-dimensional code part 13 is formed by laser-machining a solder resist layer 16 covering a copper foil layer 15. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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