| 摘要 |
PROBLEM TO BE SOLVED: To provide a magnetic sensor package for enabling size reduction. SOLUTION: An IC 2 as a semiconductor element is mounted on the main surface of a substrate 1. An X-axis magnetic sensor 3a and a Y-axis magnetic sensor 3b are mounted on the main surface of the IC 2. A Z-axis magnetic sensor 3c is mounted on the main surface of the substrate 1. The X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b are directly electrically connected to the IC 2, and the Z-axis magnetic sensor 3c is electrically connected to the IC 2 via wiring 1b. COPYRIGHT: (C)2010,JPO&INPIT
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