ELECTRONIC COMPONENT MOUNTING APPARATUS

摘要

Provided is an electronic component mounting apparatus which can perform an efficient component mounting operation to a plurality of substrates including substrates whereupon components are to be mounted on the both sides. An electronic component mounting apparatus (4) configures an electronic component mounting line (1) and mounts electronic components on substrates. The apparatus is provided with substrate transfer lanes (L1, L3) and a substrate transfer lane (L2) between two component mounting sections (22A, 22B), which take out the electronic components from component supplying sections (23A, 23B), transfer the components and mount the components on the substrates. In the transfer lanes (L1, L3) as two forward transfer paths, substrate aligning sections for aligning the substrates with the mounting operation positions and holding the substrates are arranged, and the substrates carried in from the upstream are sent to the downstream, respectively. The substrate transfer lane (L2) is arranged as a backward transfer path between the substrate transfer lanes (L1, L3) for returning the substrates carried in from the downstream to the upstream. Thus, in the case of handling substrates whereupon electronic components are to be mounted on the both sides, the substrates are automatically returned to the upstream after the electronic components are mounted on the surfaces on one side, respectively.