发明名称 ULTRAVIOLET IRRADIATION DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To increase an ultraviolet irradiation amount without depending on a size of a substrate of LED arrangement, to efficiently apply heat to an UV-curing member and to cool LED in an ultraviolet irradiation device irradiating the UV-curing member formed on a base with ultraviolet rays so as to cure it. <P>SOLUTION: A post LED substrate 22 is overlapped with a confronted LED substrate 21 where the prescribed number of LED31 face the UV-curing member 52 and are arranged in a matrix shape at intervals of regions narrower than an arranging region of single LED, and a prescribed number of holes 32 are formed in a region between LED different in rows and columns. In the post-LED substrate 22, the prescribed number of LED 41 are disposed in positions confronted with the UV-curing member 52 from the holes 32 formed in the confronted LED substrate 21. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009231392(A) 申请公布日期 2009.10.08
申请号 JP20080072563 申请日期 2008.03.19
申请人 TOPPAN FORMS CO LTD 发明人 TANAKA TAKASHI
分类号 H01L33/00;H01L33/48;H01L33/64 主分类号 H01L33/00
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