| 摘要 |
PROBLEM TO BE SOLVED: To reduce a total capacity of power semiconductor apparatus equipped with a cooling section. SOLUTION: A power semiconductor apparatus comprises a power semiconductor device 43, a plurality of power semiconductor modules 13 having a heat-conducting module substrate 41 for transferring the heat generated by the semiconductor device 43 to outside, a heat transfer plate 15 which is fixed in such a manner that it is in contact with the module substrate 41 of the semiconductor module 13, and a heat diffusion plate 16 which diffuses heat from a heat diffusion plane 24 and in which the heat transfer plate 15 is erected on a mounting plane 18 facing against the heat diffusion plane 24 so that heat can be transferred thereto. COPYRIGHT: (C)2010,JPO&INPIT |
