| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To further improve reliability of electronic components loaded on a substrate. <P>SOLUTION: Resin sealing of electronic components 26a to 26c loaded on the substrate 20 is actualized by supplying heat radiating grease into a cover 30, covering two components 26b, 26c of the electronic components 26a to 26c with the cover 30, attaching a silicon sheet not to allow the resin to be deposited on the upper surface of the cover 30, arranging these elements to a molding die, hardening the resin supplied, taking them out of the molding die, and peeling the silicon sheet. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
