| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of nondestructively troubleshooting connection relation. <P>SOLUTION: A boundary scan cell is to serve as a carrier for taking out information of an internal connection node. Further, a sensor for scanning a connection state and a level determination circuit for digitally converting the data are combined. By including such a connection detection circuit, the connection state can be nondestructively detected at all interfaces using metal wire bonding and metal bump connection. <P>COPYRIGHT: (C)2010,JPO&INPIT |
