| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an encapsulating process of an optical semiconductor element, a resin sheet for encapsulating the optical semiconductor element, can effective encapsulation by simplifying the process of disposing a metal layer on a substrate, and to provide an optical semiconductor device produced by encapsulating the optical semiconductor element which uses the resin sheet. <P>SOLUTION: A resin sheet 1 for encapsulating optical semiconductor element is constituted of at least an encapsulating resin layer 3, an adhesive resin layer 4, a metal layer 5, and a protective resin layer 2. In the resin sheet for encapsulating the optical semiconductor element, the encapsulating resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacent. The protective resin layer is laminated on the encapsulating resin layer and the metal layer so as to cover both. The encapsulating resin layer has a tapered shape, extending to the protective resin layer. An optical semiconductor device is produced by encapsulating the optical semiconductor element, by using the resin seat for encapsulating the optical semiconductor element. <P>COPYRIGHT: (C)2010,JPO&INPIT |
