发明名称 RESIN MOLDING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a resin molding whose production costs are controlled by controlling occurrence of leakage of the ink by use of no film. <P>SOLUTION: The resin molding is produced by deforming a resin tube by heating with no film to form a passage similar to that of a resin molding whose passage is formed with a film. Alternatively, the resin tube is set in a deformation mold and deformed to obtain the resin molding. Still alternatively, the resin tube is extrusion-molded to obtain the resin molding. The resin molding may have a harness portion containing a conductive material inside the resin tube. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009226673(A) 申请公布日期 2009.10.08
申请号 JP20080073067 申请日期 2008.03.21
申请人 SEIKO EPSON CORP 发明人 SAITO KAZUYUKI
分类号 B29C53/08;B29L23/00;F16L9/19;F16L11/08;F16L11/127 主分类号 B29C53/08
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