发明名称 OPTICAL COUPLING APPARATUS AND ELECTRONIC APPARATUS MOUNTED WITH THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an optical coupling apparatus, along with an electronic apparatus mounted with the same, capable of reducing the size and manufacturing cost of a controlling circuit board. Ž<P>SOLUTION: The optical coupling apparatus comprises an optical coupling element 1, comprising a light-emitting element chip 1a, which converts electric signal to optical signal, a first light-receiving element chip 1c, which converts the optical signal outputted from the light-emitting element chip 1a into electrical signal; and a primary mold part 1d, which is a translucent resin part for resin-sealing the light-emitting element chip 1a and the primary light-receiving element chip and further comprises a light-receiving element 2, which is a semiconductor element provided away from the optical coupling element 1 by a preset distance; and a secondary molded part 3, which is a light-shielding resin part for resin-sealing the optical coupling element and the light-receiving element 2, being away from each other. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009231474(A) 申请公布日期 2009.10.08
申请号 JP20080073988 申请日期 2008.03.21
申请人 SHARP CORP 发明人 HASEGAWA YASUSHI
分类号 H01L31/12 主分类号 H01L31/12
代理机构 代理人
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