发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR |
摘要 |
A semiconductor device is provided that includes a semiconductor chip and a resin section that molds the semiconductor chip and has a first through-hole. A through electrode that is electrically coupled to the semiconductor chip, extends through the resin section, and extends between a top edge and a bottom edge of an inner surface of the first through-hole. A cavity which extends between planes corresponding to an upper surface and a lower surface of the resin section is formed inside the first through-hole.
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申请公布号 |
US2009250800(A1) |
申请公布日期 |
2009.10.08 |
申请号 |
US20080239566 |
申请日期 |
2008.09.26 |
申请人 |
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发明人 |
HARAYAMA MASAHIKO;MEGURO KOUICHI;KASAI JUNICHI |
分类号 |
H01L23/48;H01L21/50;H01L21/56 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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