| 摘要 |
The present invention relates to a high density circuit board for increasing the density of a circuit by impregnating fine circuit patterns inside a top part of a substrate, and a method for manufacturing the same. In accordance with the present invention, a high density circuit board includes a substrate with fine circuit patterns impregnated inside top and bottom parts; a via formed inside the substrate to electrically conduct the fine circuit patterns of the top and bottom parts of the substrate each other; pads formed on the fine circuit patterns of the top part of the substrate; and solder resists formed on the top and bottom parts of the substrate, which can convert the circuit patterns into fine pitches and increase the degree of close adhesion between the substrate and the circuit patterns, thereby improving reliability.
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