| 摘要 |
A semiconductor device in which a plurality of semiconductor elements are stacked, yet realizing high speed operation of the semiconductor elements. The semiconductor device is provided with semiconductor packages, and a spacer. The semiconductor packages are stacked, with the spacer interposed therebetween. The semiconductor packages have, respectively, package boards, and semiconductor elements mounted on the package boards. The spacer has a plurality of conductive vias and a capacitor element. The semiconductor packages are electrically connected through the conductive vias. The capacitor element is electrically connected, among the conductive vias, to a conductive via that electrically connects the semiconductor element and power supply, and a conductive via that electrically connects the semiconductor element and ground.
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