| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive, high-yield and highly reliable semiconductor device by packaging an inexpensive and high connection strength semiconductor chip instead of conventional ACP packaging or the like as to the packaging of a semiconductor chip in a semiconductor device such as an RFID tag. <P>SOLUTION: At least one projected part is formed on a substrate electrode of a printed wiring board, at least one recessed part is formed on a bump electrode of a semiconductor chip, and at least one projected part is engaged with at least one recessed part to electrically connect both the electrodes to mount the semiconductor chip on the substrate electrode at a low cost and high intensity. Consequently, the inexpensive, high-yield and highly reliable semiconductor device can be provided. <P>COPYRIGHT: (C)2010,JPO&INPIT |
