| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that, in a multilayer wiring board wherein a dielectric layer and a conductor layer are alternatively stacked and a land is formed in an opening of a via hole and a through-hole to establish electric conduction among the conductor layers, enlarging the area of the board to some extent to surely connect the land with the via hole or the through-hole causes the same effect as an increase in area of an electrode plate of a capacitor, resulting in an increase of noises during signal transmission. SOLUTION: In this multilayer wiring board, the land is opposite to a ground plane or a power supply plane, or partly opposite thereto, and the lands themselves are conductive to each other among all parts, and voids are provided inside the land. The maximum width of the void inside the land is less than a diameter of the via hole or the through-hole to be connected with the land. COPYRIGHT: (C)2010,JPO&INPIT |
