| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a board unit and an electronic apparatus that efficiently cools heating parts while avoiding heat dissipation to the air. <P>SOLUTION: Heating parts 45 are received by an inner surface of a first heat transfer plate 51a. Heat from the heating parts 45 is transferred to a first heat transfer plate 51a. A heat insulator 53 placed on an outer surface of the first heat transfer plate 51a avoids heat dissipation to the air from the outer surface of the first heat transfer plate 51a. The heat is thus transferred from the first heat transfer plate 51a to a second heat transfer plate 54. The second heat transfer plate 54 supports a heat receiver 27 on a heat dissipation surface. The heat is then transferred from the second heat transfer plate 54 to the heat receiver 27. Through a refrigerant passage established in the heat receiver 27, the heat is transferred to a refrigerant. This cools the heating parts 45 efficiently. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
