| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem in forming the main pole of a perpendicular magnetic recording head, that the periphery of the wafer is etched faster than the inner area making the mask pattern wider at the center and narrower at the periphery in the RIE process and the main pole becomes wider at the center and narrower at the periphery if ion milling is applied as is. Ž<P>SOLUTION: First, a magnetic film 440 is formed, then a first inorganic mask film 442, an organic film 444, a second inorganic mask film 446, and a resist pattern 448 are formed on this magnetic film 440. RIE is applied by using the resist pattern 448 as a mask, and the second inorganic mask film 446 and the organic film 444 are etched to form a mask for the following process. Then, applying ion milling 1 by controlling the flow rate of Ar gas, the mask is corrected to make its width equal in the inner area and the periphery of the wafer, and the magnetic film 440 is formed with a uniform track width. Then, the main pole 44 of a reversed trapezoid shape is formed by ion milling 2. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
