| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate film for monolayer or multilayer back grinding that prevents a semiconductor wafer from being warped easily even if the substrate film is stuck to the semiconductor wafer in the back grinding process of the thin-type semiconductor wafer and has excellent dimensional stability, and to provide a back grinding film. SOLUTION: In the substrate film for multilayer back grinding, layers A, B, C are laminated in this order. The layer A contains a resin composition made of 0-70 wt.% of amorphous olefin and 30-100 wt.% of polypropylene-based resin. The layer B contains a resin composition made of 15-100 wt.% of amorphous olefin and 0-85 wt.% of polypropylene-based resin. The layer C contains a thermoplastic resin having rubber elasticity. The present invention relates to the substrate film for multilayer back grinding and the method of manufacturing the substrate film. COPYRIGHT: (C)2010,JPO&INPIT
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