COPPER ALLOY MATERIAL FOR ELECTRIC AND ELECTRONIC APPARATUSES, AND ELECTRIC AND ELECTRONIC COMPONENTS

摘要

Provided is a copper alloy material for electric and electronic apparatuses. The copper alloy material contains a Ni of 2.0 mass% or more but less than 3.3 mass%, Si within a range of 2.8-3.8 in mass ratio of Ni to Si (Ni/Si), a Mg of 0.01-0.2 mass%, a Sn of 0.05-1.5 mass%, a Zn of 0.2-1.5 mass% and the rest is composed of Cu and unavoidable impurities. When a test piece, which has a thickness (t) of 0.20mm and a width (w) of 2.0mm, is bent 180° with a bend radius (R)mm, the minimum bend radius (R) wherein breakage is not generated is 0mm or more but not more than 0.1mm. Electric and electronic components manufactured by processing such copper alloy material are also provided.