| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a component support structure in a transfer container in a semiconductor processing process. <P>SOLUTION: The transfer container includes a base 50, and a lid 60, and composes a support part of reticle 70 in a U-shape on two conflict bases 52 and a conflict component 58 on the base. The transfer container includes hard support components 55 mutually facing both ends of the inside of the conflict base respectively. Each support component includes a first high projection piece and a second low projection piece having differences of height respectively. Their apex is made an arch form to make a point contact of a support contact face. The two support components on the same conflict base arrange the second low projection piece relatively inside, and even when the reticle is displaced, and slides down from the first projection piece, the second projection piece is received. <P>COPYRIGHT: (C)2010,JPO&INPIT |
