| 摘要 |
PROBLEM TO BE SOLVED: To obtain many circuit boards from one ceramic board at low cost. SOLUTION: One large ceramic board 11 and a patternized metal pattern plate 12 which has almost the same size as the ceramic board 11 are prepared and bonded as shown in Fig.1(c). The metal pattern plate 12 is divided roughly into a circuit pattern part 12a by which identical patterns (unit patterns) of central vertical 2 columns×width 3 columns are arranged, and a periphery part 12b which exists around the circuit pattern part 12a. In any one of the circuit pattern part 12a and the periphery part 12b, individual patterns configuring the foregoings are connected by a connector 13 which is smaller than the foregoings. Then, a plating layer 14 is formed over the whole of a surface of the metal pattern plate 12. By splitting and dividing the ceramic board 11, six divided units 15 whose top view is shown in Fig.1(e) are obtained. The connecter 13 is easily cut off after dividing, for example, with a cutter or nipper or the like. COPYRIGHT: (C)2010,JPO&INPIT |
