| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board for suppressing generation of via projections, and for suppressing the rise of a resistance, as much as possible, and to provide a method for manufacturing the board. <P>SOLUTION: This multilayer wiring board is provided with: an insulating substrate 1, configured by laminating a plurality of glass ceramic insulating layers 1a, 1b, 1c, 1d and 1e; and a through-conductor 3 with any one among gold, silver and copper formed inside the glass ceramic insulating layers 1a and 1e, configuring at least a surface layer as the main components, wherein the through-conductor 3 contains glass containing at least one type selected from among a group of Sb, As, F, N and S in total, 0.01 to 0.5 mol% whose glass transfer temperature range is from 650 to 800°C. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
