发明名称 HEAT-CONDUCTIVE ADHESIVE
摘要 The invention provides a heat-conductive adhesive with high heat spread properties and excellent handleability. A pitch-based carbon fiber filler with high thermal conductivity and a smooth surface is combined with an adhesive resin to produce a heat-conductive adhesive with controlled viscosity and excellent handleability.
申请公布号 US2009250655(A1) 申请公布日期 2009.10.08
申请号 US20070373013 申请日期 2007.07.27
申请人 TEIJIN LIMITED 发明人 SANO HIROKI;HARA HIROSHI;KON TATSUICHIRO
分类号 C09K5/06 主分类号 C09K5/06
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