发明名称 RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a solid state resin composition that can be stored at a high temperature and gives a resin emulsion without requiring special facilities, and to provide a resin emulsion comprising the resin composition and water. <P>SOLUTION: The solid state resin composition comprises 100 parts by mass of a vinyl polymer having a glass transition temperature of 0 to 140°C and a weight average molecular weight of 300 to 10,000, 1 to 20 parts by mass of a surfactant, 0.1 to 10 parts by mass of a water-soluble polymer, and 0.1 to 20 parts by mass of water. The resin composition can be converted into a resin emulsion by mixing 40 to 10,000 parts by mass of water to 100 parts by mass of the composition even after the composition is stored at a high temperature, owing to the presence of the water-soluble polymer. The resin emulsion can be used as a tacky adhesive, an adhesive, a coating material, ink or a coating agent. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009227912(A) 申请公布日期 2009.10.08
申请号 JP20080077819 申请日期 2008.03.25
申请人 DENKI KAGAKU KOGYO KK 发明人 YOSHIMURA DAISUKE;KONISHI HIRONORI;KOBAYASHI KAZUHIRO
分类号 C08L101/12;C08J3/02;C08J3/20;C08L57/00;C08L57/02;C08L93/04;C08L101/14;C09D7/12;C09D11/02;C09D11/023;C09D11/033;C09D157/00;C09D157/02;C09D193/04;C09D201/00;C09J7/02;C09J11/06;C09J11/08;C09J157/00;C09J157/02;C09J193/04;C09J201/00 主分类号 C08L101/12
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