| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board that can form a conductor layer excelling in peel strength on a surface of a flat insulating layer, and excels in formation of minute wiring. SOLUTION: This manufacturing method of a multilayer printed wiring board includes the following processes of (A) to (D): (A) stacking a film with a metal film with a metal film layer formed on a support layer, on an inner layer circuit board through a curable resin composition layer, or stacking an adhesive film with a metal film with a curable resin composition layer formed on a metal film layer of a metal film layer transferring film on an inner layer circuit board; (B) curing the curable resin composition layer to form an insulating layer; (C) removing the support layer; (D) removing the metal film layer; and (E) forming a metal film layer on a surface of the insulating layer by electrodeless plating. COPYRIGHT: (C)2010,JPO&INPIT |
