METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

<P>PROBLEM TO BE SOLVED: To manufacture chips having a plurality of chip thicknesses without reducing a throughput and without increasing a manufacturing cost. Ž<P>SOLUTION: The method for manufacturing the chip includes the steps of: making the wafer thickness into a first-thickness by cutting the backside of the wafer with a semiconductor circuit corresponding to a plurality of chips formed on the surface (a step S3); taking out the first-thickness chip from the wafer (a step S4); making the thickness of the wafer into a second-thickness by further cutting the backside of the wafer (a step S5); and taking out the second-thickness chip from the wafer (a step S6). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž