| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having high adhesiveness to Ag, Pd, Pd-Au, etc. and capable of suppressing release after hygroscopic re-flow, and a semiconductor device using the composition. Ž<P>SOLUTION: The epoxy resin composition for sealing comprises an epoxy resin which is solid at ordinary temperature, a curing agent and an inorganic filler as essential components and contains a compound represented by general formula (I): (R<SP>1</SP>R<SP>2</SP>R<SP>3</SP>R<SP>4</SP>)P-SCN (R<SP>1</SP>to R<SP>4</SP>are each independently a monovalent hydrocarbon group). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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